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型號 功能描述 生產(chǎn)廠家 企業(yè) LOGO 操作
WS512K32NV-15G2TC

512Kx32 SRAM 3.3V MODULE

[White Electronic Designs Corporation] FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.88) CQFP, 4.6mm (0.180) high, (Package 509) ? 68 lead, 23.9mm (0.940 sq.) L

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

512Kx32 SRAM 3.3V MODULE

[White Electronic Designs Corporation] FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.88) CQFP, 4.6mm (0.180) high, (Package 509) ? 68 lead, 23.9mm (0.940 sq.) L

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm (0.140), (Package 510) ■ Organized as 512Kx32; User Confi gurable as 2x512Kx16 or 4x5

WEDC

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm (0.140), (Package 510) ■ Organized as 512Kx32; User Confi gurable as 2x512Kx16 or 4x5

WEDC

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm (0.140), (Package 510) ■ Organized as 512Kx32; User Confi gurable as 2x512Kx16 or 4x5

WEDC

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm (0.140), (Package 510) ■ Organized as 512Kx32; User Confi gurable as 2x512Kx16 or 4x5

WEDC

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Packaging ? 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, 22.4mm (0.880 inch) CQFP, (G2U), 3.56mm (0.140), (Package 510) ■ Organized as 512Kx32; User Confi gurable as 2x512Kx16 or 4x5

WEDC

WS512K32NV-15G2TC產(chǎn)品屬性

  • 類型

    描述

  • 型號

    WS512K32NV-15G2TC

  • 功能描述

    512Kx32 SRAM 3.3V MODULE

更新時間：2025-9-17 23:01:00
IC供應商 芯片型號 品牌 批號 封裝 庫存 備注 價格
WEDC
24+
NA/
3519
原裝現(xiàn)貨,當天可交貨,原型號開票
WED
三年內(nèi)
1983
只做原裝正品
WEDC
1018+
QFP
4
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
WEDC
23+
11200
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO
最新
2000
原裝正品現(xiàn)貨
WEDC
25+23+
BGA
22062
絕對原裝正品全新進口深圳現(xiàn)貨
WHITE
2025+
N/A
2000
原裝原廠發(fā)貨7-15工作日
W
05/06+
DIP/18
1124
原裝現(xiàn)貨海量庫存歡迎咨詢
WSI
2023+
DIP
5800
進口原裝,現(xiàn)貨熱賣
WEDC
QQ咨詢
CQFP
63
全新原裝 研究所指定供貨商

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    2013-3-13

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