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WF12價(jià)格
參考價(jià)格:¥0.1746
型號:WF1206S3R3JTL 品牌:Kamaya 備注:這里有WF12多少錢,2025年最近7天走勢,今日出價(jià),今日競價(jià),WF12批發(fā)/采購報(bào)價(jià),WF12行情走勢銷售排行榜,WF12報(bào)價(jià)。型號 | 功能描述 | 生產(chǎn)廠家 企業(yè) | LOGO | 操作 |
---|---|---|---|---|
WF12 | 包裝:散裝 描述:FOLDING TOOL,12\ 工具 專用工具 | ApexToolGroup | ||
WF121 Wi-Fi MODULE KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802 | SILABS 芯科科技 | |||
WF121 Wi-Fi MODULE KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802 | SILABS 芯科科技 | |||
WF121 Wi-Fi MODULE KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802 | SILABS 芯科科技 | |||
WF121 Wi-Fi MODULE KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802 | SILABS 芯科科技 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
5V FLASH MODULE [WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC | |||
128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0. | WEDC |
WF12產(chǎn)品屬性
- 類型
描述
- 型號
WF12
- 制造商
Weidmuller
- 功能描述
TERMINAL BLOCK HIGH CURRENT 12MM
IC供應(yīng)商 | 芯片型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
WEDC |
24+ |
PGA |
66800 |
原廠授權(quán)一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力! |
|||
SILICON/芯科 |
24+ |
MODULE |
50945 |
只做全新原裝進(jìn)口現(xiàn)貨 |
|||
WHIT |
23+ |
65480 |
|||||
SILICONLABS |
23+ |
NA |
28520 |
原裝進(jìn)口ICMCUSOCMOS等知名國內(nèi)外品牌只做原裝全 |
|||
HOMETOM ENTERPRICE CO LTD |
兩年內(nèi) |
NA |
642 |
實(shí)單價(jià)格可談 |
|||
SILICONLA |
24+ |
MODULE |
5000 |
全新原裝正品,現(xiàn)貨銷售 |
|||
AD |
DIP-8 |
2230 |
只做進(jìn)口原裝!假一賠百!自己庫存價(jià)優(yōu)! |
||||
SILICONLA |
24+ |
MODULE |
12000 |
原裝正品 假一罰十 可拆樣 |
|||
Silicon |
20+ |
模塊 |
1128 |
無線通信IC,大量現(xiàn)貨! |
|||
維峰電子 |
21+ |
20 |
全新原裝鄙視假貨 |
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2019-4-1
DdatasheetPDF頁碼索引
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