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WF12價(jià)格

參考價(jià)格:¥0.1746

型號:WF1206S3R3JTL 品牌:Kamaya 備注:這里有WF12多少錢,2025年最近7天走勢,今日出價(jià),今日競價(jià),WF12批發(fā)/采購報(bào)價(jià),WF12行情走勢銷售排行榜,WF12報(bào)價(jià)。
型號 功能描述 生產(chǎn)廠家 企業(yè) LOGO 操作
WF12

包裝:散裝 描述:FOLDING TOOL,12\ 工具 專用工具

ApexToolGroup

WF121 Wi-Fi MODULE

KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ? 2.4GHz band IEEE 802.11 b/g/n radio ? Excellent radio performance: ? TX power: +16 dBm ? RX sensitivity: -97 dBm ? Host interfaces: ? 10Mbps UART ? SPI ? USB device ? Peripheral interfaces: ? GPIO, ADC and timers ? I2C, SPI and UART ? Ethernet ? Embedded TCP/IP and 802

SILABS

芯科科技

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture ? 8 equal size sectors of 16KBytes each per chip ? Any combination of sectors can be concurrently erased. Al

ETC1List of Unclassifed Manufacturers

etc未分類制造商未分類制造商

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: ? 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ? 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) ? 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

WF12產(chǎn)品屬性

  • 類型

    描述

  • 型號

    WF12

  • 制造商

    Weidmuller

  • 功能描述

    TERMINAL BLOCK HIGH CURRENT 12MM

更新時(shí)間:2025-9-18 15:00:00
IC供應(yīng)商 芯片型號 品牌 批號 封裝 庫存 備注 價(jià)格
WEDC
24+
PGA
66800
原廠授權(quán)一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力!
SILICON/芯科
24+
MODULE
50945
只做全新原裝進(jìn)口現(xiàn)貨
WHIT
23+
65480
SILICONLABS
23+
NA
28520
原裝進(jìn)口ICMCUSOCMOS等知名國內(nèi)外品牌只做原裝全
HOMETOM ENTERPRICE CO LTD
兩年內(nèi)
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20
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