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UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ? ESD Protection > 25 kilovolts ? Available in Six Voltage Types Ranging From 3.3V to 24V ? Low ESD Overshoot Voltage ? Bidirectional Configuration & Monolithic Structure ? Protects 1 Line ? LOW CAPACITANCE: 6pF ? LOW LEAKAGE CURRENT APPLICATIONS ? Cellular Phones ? Personal

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

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200W LOW CAPACITANCE flip chip tvs array

DESCRIPTION The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series

FLIP CHIP ARRAY

DESCRIPTION The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series m

200W LOW CAPACITANCE FLIP CHIP TVS ARRAY

文件：625.57 Kbytes Page：9 Pages

FLIP CHIP ARRAY

文件：106.18 Kbytes Page：5 Pages

FLIP CHIP ARRAY

文件：106.17 Kbytes Page：5 Pages