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位置:LMZ30602RKGT.A > LMZ30602RKGT.A詳情

LMZ30602RKGT.A中文資料

廠家型號(hào)

LMZ30602RKGT.A

文件大小

884.05Kbytes

頁(yè)面數(shù)量

35頁(yè)

功能描述

LMZ30602 2-A Power Module With 2.95-V to 6-V Input in QFN Package

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

生產(chǎn)廠商

TI2

LMZ30602RKGT.A數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

1 Features

1? Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

? 9 mm × 11 mm × 2.8 mm package

- Pin Compatible with LMZ30604 and LMZ30606

? Efficiencies Up To 96%

? Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

? Adjustable Switching Frequency

(500 kHz to 2 MHz)

? Synchronizes to an External Clock

? Adjustable Slow-Start

? Output Voltage Sequencing / Tracking

? Power Good Output

? Programmable Undervoltage Lockout (UVLO)

? Output Overcurrent Protection

? Over Temperature Protection

? Operating Temperature Range: –40°C to 85°C

? Enhanced Thermal Performance: 12°C/W

? Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

? Create a Custom Design Using the LMZ30602

With the WEBENCH? Power Designer

2 Applications

? Broadband & Communications Infrastructure

? Automated Test and Medical Equipment

? Compact PCI / PCI Express / PXI Express

? DSP and FPGA Point of Load Applications

? High Density Distributed Power Systems

3 Description

The LMZ30602 power module is an easy-to-use

integrated power solution that combines a 2-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution requires as few as 3 external

components and eliminates the loop compensation

and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 2-A rated output current at

85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

更新時(shí)間:2025-9-24 11:10:00
供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
TI/德州儀器
23+
QFN
3000
一級(jí)代理原廠VIP渠道,專注軍工、汽車(chē)、醫(yī)療、工業(yè)、
TI德州儀器
22+
24000
原裝正品現(xiàn)貨,實(shí)單可談,量大價(jià)優(yōu)
TI/德州儀器
23+
RFIDSUB-0
30000
原裝正品,支持實(shí)單
TI/德州儀器
25+
RFIDSUB-0
30000
原裝正品長(zhǎng)期現(xiàn)貨
NA
23+
NA
26094
10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品,做服務(wù)型企業(yè)
80000
TI
24+
QFN39
10000
低于市場(chǎng)價(jià),實(shí)單必成,QQ1562321770
TI(德州儀器)
24+
NA/
7350
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!!
TI
23+
NA
6800
原裝正品,力挺實(shí)單
TI(德州儀器)
22+
N/A
3206
原裝正品物料