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位置:LMZ30602RKGR.B > LMZ30602RKGR.B詳情

LMZ30602RKGR.B中文資料

廠家型號

LMZ30602RKGR.B

文件大小

884.05Kbytes

頁面數(shù)量

35

功能描述

LMZ30602 2-A Power Module With 2.95-V to 6-V Input in QFN Package

數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

生產(chǎn)廠商

TI2

LMZ30602RKGR.B數(shù)據(jù)手冊規(guī)格書PDF詳情

1 Features

1? Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

? 9 mm × 11 mm × 2.8 mm package

- Pin Compatible with LMZ30604 and LMZ30606

? Efficiencies Up To 96%

? Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

? Adjustable Switching Frequency

(500 kHz to 2 MHz)

? Synchronizes to an External Clock

? Adjustable Slow-Start

? Output Voltage Sequencing / Tracking

? Power Good Output

? Programmable Undervoltage Lockout (UVLO)

? Output Overcurrent Protection

? Over Temperature Protection

? Operating Temperature Range: –40°C to 85°C

? Enhanced Thermal Performance: 12°C/W

? Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

? Create a Custom Design Using the LMZ30602

With the WEBENCH? Power Designer

2 Applications

? Broadband & Communications Infrastructure

? Automated Test and Medical Equipment

? Compact PCI / PCI Express / PXI Express

? DSP and FPGA Point of Load Applications

? High Density Distributed Power Systems

3 Description

The LMZ30602 power module is an easy-to-use

integrated power solution that combines a 2-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution requires as few as 3 external

components and eliminates the loop compensation

and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 2-A rated output current at

85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

更新時間:2025-9-24 11:00:00
供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
TI/德州儀器
23+
B1QFN47
50000
全新原裝正品現(xiàn)貨,支持訂貨
TI
三年內(nèi)
1983
只做原裝正品
TI
17+
10000
原裝正品
TI
20+
NA
53650
TI原裝主營-可開原型號增稅票
TI德州儀器
20+
39-B1QFN
16500
只做全新原裝,支持樣品
24+
37200
原裝現(xiàn)貨/放心購買
TI(德州儀器)
2447
B1QFN-39
105000
250個/圓盤一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長
TEXAS
20+
電源模塊
1520
就找我吧!--邀您體驗愉快問購元件!
TI(德州儀器)
2021+
B1QFN-39
509
TI/德州儀器
2021+
B1QFN-39
7600
原裝現(xiàn)貨,歡迎詢價