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封裝/外殼：0603（1608 公制） 包裝：卷帶（TR） 描述：RES 150K OHM 0.1% 1/10W 0603 電阻器 片式電阻器 - 表面貼裝

封裝/外殼：0603（1608 公制） 包裝：卷帶（TR） 描述：RES 150K OHM 0.1% 1/10W 0603 電阻器 片式電阻器 - 表面貼裝

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer ?? provides compatibility with lead (Pb)-free and lead ?? containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer ?? provides compatibility with lead (Pb)-free and lead ?? containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer ?? provides compatibility with lead (Pb)-free and lead ?? containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer ?? provides compatibility with lead (Pb)-free and lead ?? containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer ?? provides compatibility with lead (Pb)-free and lead ?? containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified