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Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Memory Card IC 256/128 Kbit Serial I?C Bus EEPROM

DESCRIPTION Each device is an electrically erasable programmable memory (EEPROM) fabricated with STMicroelectronics’s High Endurance, Double Polysilicon, CMOS technology. This guarantees an endurance typically well above 100,000 Erase/Write cycles, with a data retention of 40 years. The memory op

Continuous Hinge Door with Quarter Turn

Application -Designed to enclose electrical and/or electronic equipment and protect against harsh,industrial environments. -For use as instrument enclosures, electric, hydraulic or pneumatic control housings,electrical junction boxes or terminal wiring enclosures. -Impressive styling features m

Mounting brackets required to meet UL/CSA external mounting requirements.

文件：1.06838 Mbytes Page：4 Pages

Mounting brackets required to meet UL/CSA external mounting requirements.

文件：1.06838 Mbytes Page：4 Pages

Oval beam for area lighting

文件：1.9026 Mbytes Page：4 Pages

DATA SUBJECT TO CHANGE WITHOUT NOTLCE

文件：137.94 Kbytes Page：1 Pages