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型號 功能描述 生產(chǎn)廠家&企業(yè) LOGO 操作
CC1352P7

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller ?Powerful48-MHzArm?Cortex?-M4Fprocessor ?352KBflashprogrammemory ?256KBofROMforprotocolsandlibraryfunctions ?8KBofcacheSRAM ?80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation ?Dynamicmultiprotocolmanager(

TITexas Instruments

德州儀器美國德州儀器公司

TI
CC1352P7

CC2642R-Q1SimpleLink?Bluetooth?5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller ?Powerful48-MHzArm?Cortex?-M4processor ?EEMBCCoreMark?score:148 ?352KBflashprogrammemory ?256KBofROMforprotocolsandlibraryfunctions ?8KBofcacheSRAM ?80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation ?2-

TITexas Instruments

德州儀器美國德州儀器公司

TI
CC1352P7

CC2674P10SimpleLink?High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州儀器美國德州儀器公司

TI
CC1352P7

CC2674R10SimpleLink?High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC2340R5-Q1SimpleLink?Bluetooth?5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller ?AEC-Q100Grade2qualifiedforAutomotive applications ?Optimized48-MHzArm?Cortex?-M0+processor ?512KBofin-systemprogrammableflash ?12KBofROMforbootloaderanddrivers ?36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC2340R2SimpleLink?Bluetooth?5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller ?Optimized48-MHzArm?Cortex?-M0+processor ?256KBofin-systemprogrammableflash ?12KBofROMforbootloaderanddrivers ?28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode ?2.4GHzRFtransceivercompatiblewith Bluetooth?5.3

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC2340R2SimpleLink?Bluetooth?5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller ?Optimized48-MHzArm?Cortex?-M0+processor ?256KBofin-systemprogrammableflash ?12KBofROMforbootloaderanddrivers ?28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode ?2.4GHzRFtransceivercompatiblewith Bluetooth?5.3

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC1314R10SimpleLink?High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC2674P10SimpleLink?High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州儀器美國德州儀器公司

TI1
CC1352P7

CC1352P7SimpleLink??High-PerformanceMulti-BandWirelessMCUWithIntegratedPowerAmplifier

文件：3.92276 Mbytes Page：82 Pages

TITexas Instruments

德州儀器美國德州儀器公司

TI
CC1352P7

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件：3.51768 Mbytes Page：63 Pages

TITexas Instruments

德州儀器美國德州儀器公司

TI

CC1352P7SimpleLink??High-PerformanceMulti-BandWirelessMCUWithIntegratedPowerAmplifier

文件：3.92276 Mbytes Page：82 Pages

TITexas Instruments

德州儀器美國德州儀器公司

TI

封裝/外殼：48-VFQFN 裸露焊盤 包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 描述：SIMPLELINK ARM CORTEX-M4F MULTIP RF/IF，射頻/中頻和 RFID 射頻收發(fā)器 IC

TI2Texas Instruments

德州儀器美國德州儀器公司

TI2
更新時間：2025-7-24 17:59:00
IC供應商 芯片型號 品牌 批號 封裝 庫存 備注 價格
Texas Instruments
24+
VQFN-48
3265
全新原廠原裝，進口正品現(xiàn)貨，正規(guī)渠道可含稅??！
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可開原型號增稅票
TI
23+
QFN48
24500
交個朋友支持實單
TI(德州儀器)
23+
NA
20094
正納10年以上分銷經(jīng)驗原裝進口正品做服務做口碑有支持
TI
24+
VQFN48
28900
只做原裝正品,公司現(xiàn)貨
TI
23+
VQFN-48
20000
TI(德州儀器)
24+
標準封裝
10048
原廠直銷,大量現(xiàn)貨庫存,交期快。價格優(yōu),支持賬期
TI(德州儀器)
24+
NA/
7350
現(xiàn)貨供應,當天可交貨!免費送樣,原廠技術支持!!!
TI
24+
VQFN-48
5000
全新原裝正品,現(xiàn)貨銷售
TI
24+
VQFN-48
8000
原裝，正品

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