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C1608C0G1E103J價(jià)格

參考價(jià)格:¥0.3309

型號(hào):C1608C0G1E103J080AA 品牌:TDK 備注:這里有C1608C0G1E103J多少錢(qián),2025年最近7天走勢(shì),今日出價(jià),今日競(jìng)價(jià),C1608C0G1E103J批發(fā)/采購(gòu)報(bào)價(jià),C1608C0G1E103J行情走勢(shì)銷(xiāo)售排行榜,C1608C0G1E103J報(bào)價(jià)。
型號(hào) 功能描述 生產(chǎn)廠家&企業(yè) LOGO 操作
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

CKCSeriesCommercialGrade4in1Array

MultilayerCeramicChipCapacitors ArrayType(4-Element) CKCA43Type FEATURES ?Fourcapacitorsarefittedinasinglepackage. ?Capableofreducingthenumberofparts,contributingtoreducedmountingareaandcost. ?EffectiveforEMCcontrolaroundconnectors,etc.,whenusedasnoiseby

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

CKGSeriesCommercialGradeMEGACAPType

MULTILAYERCERAMICCHIPCAPACITORS Commercialgrade,MEGACAPtype SERIESOVERVIEW TDKmultilayerceramicchipcapacitorCKGseriesisaproductwhichmetalframesareconnectedtoterminationsofMLCC,anditisalsocalledMEGACAP.MEGACAPhashighermechanicalendurancebytheflexiblemetal

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Lowresidualinductanceassuressuperiorfrequencycharacteristics. ?Excellent

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

CSeriesCommercialGradeHighVoltage(1000Vandover)

文件:1.19794 Mbytes Page:7 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57186 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

CSeriesCommercialGradeGeneral(Upto50V)

文件:1.13758 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.74951 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:885.17 Kbytes Page:20 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57112 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

PartNumberChangeNotification

文件:110.16 Kbytes Page:8 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

CGJSeriesHighReliabilityGradeGeneral(Upto50V)

文件:1.57282 Mbytes Page:11 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57186 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.74951 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK
C1608C0G1E103J

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.36314 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Lowresidualinductanceassuressuperiorfrequencycharacteristics. ?Excellent

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CKGSeriesCommercialGradeMEGACAPType

MULTILAYERCERAMICCHIPCAPACITORS Commercialgrade,MEGACAPtype SERIESOVERVIEW TDKmultilayerceramicchipcapacitorCKGseriesisaproductwhichmetalframesareconnectedtoterminationsofMLCC,anditisalsocalledMEGACAP.MEGACAPhashighermechanicalendurancebytheflexiblemetal

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CKCSeriesCommercialGrade4in1Array

MultilayerCeramicChipCapacitors ArrayType(4-Element) CKCA43Type FEATURES ?Fourcapacitorsarefittedinasinglepackage. ?Capableofreducingthenumberofparts,contributingtoreducedmountingareaandcost. ?EffectiveforEMCcontrolaroundconnectors,etc.,whenusedasnoiseby

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CSeriesCommercialGradeHighVoltage(1000Vandover)

文件:1.19794 Mbytes Page:7 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CSeriesCommercialGradeHighVoltage(1000Vandover)

文件:1.19794 Mbytes Page:7 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

封裝/外殼:0603(1608 公制) 包裝:卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶 描述:CAP CER 10000PF 25V C0G 0603 電容器 陶瓷電容器

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57186 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

PartNumberChangeNotification

文件:110.16 Kbytes Page:8 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57112 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:2.57186 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:885.17 Kbytes Page:20 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.74951 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CGJSeriesHighReliabilityGradeGeneral(Upto50V)

文件:1.57282 Mbytes Page:11 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.74951 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CSeriesCommercialGradeGeneral(Upto50V)

文件:1.13758 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

封裝/外殼:0603(1608 公制) 包裝:卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶 描述:CAP CER 10000PF 25V C0G 0603 電容器 陶瓷電容器

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.36314 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

CommercialGrade(General(Upto50V))

文件:131.68 Kbytes Page:1 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MultilayerCeramicChipCapacitors

文件:184.29 Kbytes Page:3 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

ContainsallsupportcircuitryneededfortheADS1148/ADS1248

文件:1.83652 Mbytes Page:34 Pages

TI1Texas Instruments

德州儀器美國(guó)德州儀器公司

TI1

ContainsallsupportcircuitryneededfortheADS1146/ADS1246

文件:2.33022 Mbytes Page:27 Pages

TI1Texas Instruments

德州儀器美國(guó)德州儀器公司

TI1

MULTILAYERCERAMICCHIPCAPACITORS

文件:885.17 Kbytes Page:20 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.031 Mbytes Page:1 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

文件:1.031 Mbytes Page:55 Pages

TDKTDK Corporation

TDK株式會(huì)社東電化(中國(guó))投資有限公司

TDK

C1608C0G1E103J產(chǎn)品屬性

  • 類(lèi)型

    描述

  • 型號(hào)

    C1608C0G1E103J

  • 功能描述

    多層陶瓷電容器MLCC - SMD/SMT 0603 0.01uF 25volts C0G 5%

  • RoHS

  • 制造商

    American Technical Ceramics(ATC)

  • 電容

    10 pF

  • 容差

    1 %

  • 電壓額定值

    250 V

  • 溫度系數(shù)/代碼

    C0G(NP0) 外殼代碼 -

  • in

    0505 外殼代碼 -

  • mm

    1414

  • 工作溫度范圍

    - 55 C to + 125 C

  • 產(chǎn)品

    Low ESR MLCCs

  • 封裝

    Reel

更新時(shí)間:2025-7-21 17:39:00
IC供應(yīng)商 芯片型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
TDK
23+
SMD
42000
0603 C0G 25V 10NF 5%
TDK
2025+
SMD
16854648
代理銷(xiāo)售TDK原裝現(xiàn)貨
TDK
21+
SMD
15374
原裝現(xiàn)貨假一賠十
TDK/東電化
23+
0603
10000
原廠授權(quán)一級(jí)代理,專(zhuān)業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
TDK
1517+
SMD
14174
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力
TDK
3000
全新原裝 貨期兩周
TDK
23+
SMD
55000
0603 C0G 25V 10NF 5%
TDK
24+
SMD
80000
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開(kāi)13%增
TDK
24+
0603
4000
優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票
TDK(東電化)
24+
SMD
21222
TDK原廠直供,全系列可訂貨。美金交易,大陸交貨。

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