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768205103FP

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

更新時(shí)間：2025-9-19 15:32:00
IC供應(yīng)商 芯片型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
TE/泰科
2508+
/
484664
一級(jí)代理，原裝現(xiàn)貨
Fox
1716+
XpressO
8660
只做原裝進(jìn)口,假一罰十
CTS
23+
SOP20
5000
原廠授權(quán)代理,海外優(yōu)勢(shì)訂貨渠道?？商峁┐罅繋齑?詳
24+
N/A
70000
一級(jí)代理-主營優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
TE/泰科
23+
NA/原裝
82985
代理-優(yōu)勢(shì)-原裝-正品-現(xiàn)貨*期貨
TE/AMP
2022
連接器
10000
全新、原裝
TE
新
6
全新原裝 貨期兩周

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