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44067價(jià)格

參考價(jià)格：￥1.7825

型號(hào)：44067-0201 品牌：Molex 備注：這里有44067多少錢(qián)，2025年最近7天走勢(shì)，今日出價(jià)，今日競(jìng)價(jià)，44067批發(fā)/采購(gòu)報(bào)價(jià)，44067行情走勢(shì)銷(xiāo)售排行榜，44067報(bào)價(jià)。
型號(hào) 功能描述 生產(chǎn)廠家&企業(yè) LOGO 操作
44067

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck Inc.

圖爾克德國(guó)圖爾克集團(tuán)公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck Inc.

圖爾克德國(guó)圖爾克集團(tuán)公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac

TURCKTurck Inc.

圖爾克德國(guó)圖爾克集團(tuán)公司

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.01 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.02 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating

文件：216.02 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.02 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.01 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating

文件：216.03 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.02 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.03 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating

文件：216.07 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

文件：216.03 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating

文件：216.01 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating

文件：216.01 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件：216.03 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件：216.03 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating

文件：216.08 Kbytes Page：3 Pages

MOLEX6

莫仕

Driver IC for stepping motor

Low Ron, Various Current Ranges Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce these NEW Stepper Motor Driver Series to their already existing product line. This broadened selection of IC’s for Stepper Motor Drivers offer built-in functionality in smaller case

Panasonic

松下

Driver IC for Stepping Motor

Low Ron, Various Current Ranges Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce these NEW Stepper Motor Driver Series to their already existing product line. This broadened selection of IC’s for Stepper Motor Drivers offer built-in functionality in smaller case

Panasonic

松下

Stepper Motor Driver IC?? From Panasonic

文件：387.06 Kbytes Page：1 Pages

Panasonic

松下

44067產(chǎn)品屬性

  • 類型

    描述

  • 型號(hào)

    44067

  • 功能描述

    集管和線殼 Microfit Vert Hdr TH DR Tin 2Ckt

  • RoHS

    否

  • 產(chǎn)品種類

    1.0MM Rectangular Connectors

  • 產(chǎn)品類型

    Headers - Pin Strip

  • 系列

    DF50

  • 觸點(diǎn)類型

    Pin(Male)

  • 節(jié)距

    1 mm

  • 位置/觸點(diǎn)數(shù)量

    16

  • 排數(shù)

    1

  • 安裝風(fēng)格

    SMD/SMT

  • 安裝角

    Right

  • 端接類型

    Solder

  • 外殼材料

    Liquid Crystal Polymer(LCP)

  • 觸點(diǎn)材料

    Brass

  • 觸點(diǎn)電鍍

    Gold

  • 制造商

    Hirose Connector

更新時(shí)間：2025-9-10 16:26:00
IC供應(yīng)商 芯片型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
MOLEX/莫仕
2508+
/
484664
一級(jí)代理，原裝現(xiàn)貨
MOLEX
2450+
SOP
6540
只做原廠原裝正品終端客戶免費(fèi)申請(qǐng)樣品
MOLEX/莫仕
24+
39997
原廠現(xiàn)貨渠道
TYCO/AMP
23+
4800
原廠授權(quán)代理,海外優(yōu)勢(shì)訂貨渠道?？商峁┐罅繋?kù)存,詳
24+
N/A
72000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
MOLEX
24+
con
35960
查現(xiàn)貨到京北通宇商城
MOLEX INC
24+
SMD
8600
正品原裝,正規(guī)渠道,免費(fèi)送樣。支持賬期,BOM一站式配齊
Molex
24+
con
2500
CJT品牌降本替代型號(hào)C3030WV-2x8P-LCP-G30-D40

44067芯片相關(guān)品牌

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