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TMP275AIDGKR.B中文資料

廠家型號(hào)

TMP275AIDGKR.B

文件大小

791.04Kbytes

頁(yè)面數(shù)量

35頁(yè)

功能描述

TMP275 ±0.5°C Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout

數(shù)據(jù)手冊(cè)

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生產(chǎn)廠商

TI2

TMP275AIDGKR.B數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

1 Features

1? High Accuracy:

– ±0.5°C (Maximum) From ?20°C to 100°C

– ±1°C (Maximum) From ?40°C to 125°C

? Low Quiescent Current:

– 50 μA (Typical)

– 0.1-μA Standby

? Resolution: 9 to 12 Bits, User-Selectable

? Digital Output: SMBus?, Two-Wire, and I2C

Interface Compatibility

? 8 I2C/SMBus Addresses

? Wide Supply Range: 2.7 V to 5.5 V

? Small VSSOP-8 and SOIC-8 Packages

? No Specified Power-up Sequence Required; Two-

Wire Bus Pullups May Be Enabled Before V+

2 Applications

? Power-Supply Temperature Monitoring

? Computer Peripheral Thermal Protection

? Battery Management

? Office Machines

? Servers

? Thermostat Controls

? Environmental Monitoring and HVAC

? Electromechanical Device Temperature

? Data Logger

3 Description

The TMP275 is a ±0.5°C accurate integrated digital

temperature sensor with a 12-bit analog-to-digital

converter (ADC) that can operate as low as 2.7-V

supply voltage and is pin- and register-compatible

with the Texas Instruments LM75, TMP75, TMP75B,

and TMP175 devices. This device is available in

SOIC-8 and VSSOP-8 packages, and it requires no

external components to sense the temperature. The

TMP275 is capable of reading temperatures with a

maximum resolution of 0.0625°C (12 bits) and as low

as 0.5°C (9 bits), which allows the user to maximize

efficiency by programming for higher resolution or

faster conversion time. The device is specified over a

temperature range of –40°C to 125°C.

The TMP275 device features SMBus and two-wire

interface compatibility, and allows up to eight devices

on the same bus with the SMBus overtemperature

alert function. The factory-calibrated temperature

accuracy and the noise-immune digital interface

make the TMP275 the preferred solution for

temperature compensation of other sensors and

electronic components, without the need for

additional system-level calibration or elaborate board

layout for distributed temperature sensing.

更新時(shí)間:2025-9-23 14:07:00
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3000
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5963
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NA
19960
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34076
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