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位置:SN74LVC3G17DCUR.B > SN74LVC3G17DCUR.B詳情

SN74LVC3G17DCUR.B中文資料

廠家型號(hào)

SN74LVC3G17DCUR.B

文件大小

797.52Kbytes

頁(yè)面數(shù)量

27頁(yè)

功能描述

SN74LVC3G17 Triple Schmitt-Trigger Buffer

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

生產(chǎn)廠商

TI2

SN74LVC3G17DCUR.B數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

1 Features

1? Available in the Texas Instruments

NanoFree? Package

? Supports 5-V VCC Operation

? Inputs Accept Voltages to 5.5 V

? Maximum tpd of 5.4 ns at 3.3 V

? Low Power Consumption, 10-μA Maximum ICC

? ±24-mA Output Drive at 3.3 V

? Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

? Typical V OHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA = 25°C

? I off Supports Live Insertion, Partial-Power-Down

Mode and Back Drive Protection

? Latch-Up Performance Exceeds 100 mA

Per JESD 78, Class II

? ESD Protection Exceeds JESD 22

– 2000-V Human Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

2 Applications

? AV Receivers

? Audio Docks: Portable

? Blu-ray? Players and Home Theater

? MP3 Players/Recorders

? Personal Digital Assistants (PDAs)

? Power: Telecom/Server AC/DC Supply: Single

Controller: Analog and Digital

? Solid State Drives (SSDs): Client and Enterprise

? TVs: LCD/Digital and High-Definition (HDTVs)

? Tablets: Enterprise

? Video Analytics: Server

? Wireless Headsets, Keyboards, and Mice

3 Description

This triple Schmitt-trigger buffer is designed for

1.65-V to 5.5-V VCC operation.

The SN74LVC3G17 device contains three buffers

and performs the Boolean function Y = A. The device functions as three independent buffers but, because

of Schmitt action, it may have different input threshold

levels for positive-going (VT+) and negative-going

(VT–) signals.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

NanoFree package technology is a major

breakthrough in IC packaging concepts, using the die as the package.

更新時(shí)間:2025-9-21 15:14:00
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