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位置:PAL16R8AMJ.A > PAL16R8AMJ.A詳情

PAL16R8AMJ.A中文資料

廠家型號(hào)

PAL16R8AMJ.A

文件大小

833.12Kbytes

頁(yè)面數(shù)量

22頁(yè)

功能描述

STANDARD HIGH-SPEED PAL) CIRCUITS

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

生產(chǎn)廠商

TI2

PAL16R8AMJ.A數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

Choice of Operating Speeds

High-Speed, A Devices . . . 25 MHz Min

Half-Power, A-2 Devices . . . 16 MHz Min

Choice of Input/Output Configuration

Package Options Include Both Ceramic DIP

and Chip Carrier in Addition to Ceramic

Flat Package

description

These programmable array logic devices feature

high speed and a choice of either standard or

half-power devices. They combine Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses. These devices will

provide reliable, high-performance substitutes for

conventional TTL logic. Their easy

programmability allow for quick design of ”custom”

functions and typically results in a more compact

circuit board. In addition, chip carriers are

available for further reduction in board space.

The Half-Power versions offer a choice of

operating frequency, switching speeds, and

power dissipation. In many cases, these

Half-Power devices can result in significant power

reduction from an overall system level.

The PAL16’ M series is characterized for

operation over the full military temperature range

of –55°C to 125°C.

更新時(shí)間:2025-9-24 15:01:00
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