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1 Features

1? Complete Integrated Power Solution;

Smaller than a Discrete Design

? 15 mm × 16 mm × 5.8 mm Package Size

- Pin Compatible with LMZ31520

? Ultra-Fast Load Step Response

? Efficiencies Up To 96%

? Wide-Output Voltage Adjust

0.6 V to 3.6 V, with 1% Reference Accuracy

? Optional Split Power Rails Allows

Input Voltage Down to 3 V

? Selectable Switching Frequency;

(300 kHz to 850 kHz)

? Selectable Slow-Start

? Adjustable Over Current Limit

? Power Good Output

? Output Voltage Sequencing

? Over Temperature Protection

? Pre-bias Output Start-up

? Operating Temperature Range: –40°C to 85°C

? Enhanced Thermal Performance: 8.6°C/W

? Meets EN55022 Class A Emissions

- Integrated Shielded Inductor

? Create a Custom Design Using the LMZ31530

With the WEBENCH? Power Designer

2 Applications

? Broadband and Communications Infrastructure

? DSP and FPGA Point of Load Applications

? High Density Power Systems

3 Description

The LMZ31530 power module is an easy-to-use

integrated power solution that combines a 30-A

DC/DC converter with power MOSFETs, a shielded

inductor, and passives into a low profile, QFN

package. This total power solution allows as few as

three external components and eliminates the loop

compensation and magnetics part selection process.

The 15 × 16 × 5.8 mm, QFN package is easy to

solder onto a printed circuit board and allows a

compact point-of-load design. Achieves greater than

95% efficiency, has ultra-fast load step response and

excellent power dissipation capability with a thermal

impedance of 8.6°C/W. The LMZ31530 offers the

flexibility and the feature-set of a discrete point-ofload

design and is ideal for powering a wide range of

ICs and systems. Advanced packaging technology

affords a robust and reliable power solution

compatible with standard QFN mounting and testing

techniques.