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位置:LMZ30606RKGR.B > LMZ30606RKGR.B詳情

LMZ30606RKGR.B中文資料

廠家型號(hào)

LMZ30606RKGR.B

文件大小

894.33Kbytes

頁(yè)面數(shù)量

34頁(yè)

功能描述

LMZ30606 6A Power Module with 2.95V-6V Input in QFN Package

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

生產(chǎn)廠商

TI2

LMZ30606RKGR.B數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

1 Features

1? Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

? 9mm x 11mm x 2.8mm package

- Pin Compatible with LMZ30602 & LMZ30604

? Efficiencies Up To 96%

? Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

? Adjustable Switching Frequency

(500 kHz to 2 MHz)

? Synchronizes to an External Clock

? Adjustable Slow-Start

? Output Voltage Sequencing / Tracking

? Power Good Output

? Programmable Undervoltage Lockout (UVLO)

? Output Overcurrent Protection

? Over Temperature Protection

? Operating Temperature Range: –40°C to 85°C

? Enhanced Thermal Performance: 12°C/W

? Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

? Create a Custom Design Using the LMZ30606

With the WEBENCH? Power Designer

2 Applications

? Broadband and Communications Infrastructure

? Automated Test and Medical Equipment

? Compact PCI / PCI Express / PXI Express

? DSP and FPGA Point of Load Applications

? High Density Distributed Power Systems

3 Description

The LMZ30606 SIMPLE SWITCHER? power module

is an easy-to-use integrated power solution that

combines a 6-A DC/DC converter with power

MOSFETs, a shielded inductor, and passives into a

low profile, QFN package. This total power solution

requires as few as 3 external components and

eliminates the loop compensation and magnetics part

selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 6-A rated output current at

85°C ambient temperature without airflow.

The LMZ30606 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

更新時(shí)間:2025-9-24 14:26:00
供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
TI
24+
SMD
85450
TI一級(jí)代理商原裝進(jìn)口現(xiàn)貨
TI
25+23+
QFN
44741
絕對(duì)原裝正品全新進(jìn)口深圳現(xiàn)貨
TI
三年內(nèi)
1983
只做原裝正品
TI
17+
10000
原裝正品
TI/德州儀器
20+
QFN
2800
絕對(duì)全新原裝現(xiàn)貨,歡迎來(lái)電查詢
TI
20+
原裝
65790
原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開(kāi)原型號(hào)增稅票
TI
24+
QFN
36500
一級(jí)代理/放心采購(gòu)
TI(德州儀器)
2447
B1QFN-39
105000
250個(gè)/圓盤一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)
TEXAS
20+
電源模塊
1520
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件!
TI(德州儀器)
2021+
B1QFN-39
499