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1 Features

? Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

? 9 mm × 11 mm × 2.8 mm package

- Pin Compatible with LMZ30602 and LMZ30606

? Efficiencies Up To 96%

? Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

? Adjustable Switching Frequency

(500 kHz to 2 MHz)

? Synchronizes to an External Clock

? Adjustable Slow-Start

? Output Voltage Sequencing / Tracking

? Power Good Output

? Programmable Undervoltage Lockout (UVLO)

? Output Overcurrent Protection

? Over Temperature Protection

? Operating Temperature Range: –40°C to 85°C

? Enhanced Thermal Performance: 12°C/W

? Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

? Create a Custom Design Using the LMZ30604

With the WEBENCH? Power Designer

2 Applications

? Broadband and Communications Infrastructure

? Automated Test and Medical Equipment

? Compact PCI / PCI Express / PXI Express

? DSP and FPGA Point of Load Applications

? High Density Distributed Power Systems

3 Description

The LMZ30604 power module is an easy-to-use

integrated power solution that combines a 4-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution requires as few as 3 external

components and eliminates the loop compensation

and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 4-A rated output current at

85°C ambient temperature without airflow.

The LMZ30604 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.