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1.1 Features 1
? TI's Single-Chip Bluetooth? Solution With
Bluetooth Basic Rate (BR), Enhanced Data Rate
(EDR), and Low Energy (LE) Support
? Bluetooth 5.1 Delaration ID D049226
? Highly Optimized for Size-Constrained and Low-
Cost Designs:
– Single-Ended 50-Ω RF Interface
– VQFNP-MR Package Family, RVM Footprint: 76
Terminals, 0.6-mm Pitch, 8-mm × 8-mm
? BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
Modified Subband Coding (mSBC), and
Transparent (Uncoded)
– Provide an Assisted Mode for HFP 1.6
Wideband Speech (WBS) Profile or A2DP
Profile to Reduce Host Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
? Low Energy Features Include:
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
– Capabilities of Link Layer Topology
Scatternet—Can Act Concurrently as Peripheral
and Central
– Network Support for up to 10 Devices
– Time Line Optimization Algorithms to Achieve
Maximum Channel Utliization
? Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1 TX Power up to +12 dBm
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Longer Range, Including Twice the Range of
Other Low-Energy-Only Solutions
? Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
? Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
– UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
– Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
? Flexibility for Easy Stack Integration and Validation
Into MCUs and MPUs
? HCI Tester Tool to Evaluate RF Performance of
the Device and Configure Service Pack
1.2 Applications
? Wireless Audio Solutions
? mPOS
? Medical Devices
? Set-Top Boxes (STBs)
? Wearable Devices
? Sensor Hub, Sensor Gateway
– Home and Factory Automation
1.3 Description
The CC2564C device from Texas Instruments? is a complete Bluetooth? BR/EDR, and low energy HCI
level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration
Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-
compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer
topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other
Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host
MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and
software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low
energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The
iPod? (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:
Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
TI |
24+ |
SMD |
8000 |
射頻收發(fā)器 |
|||
TI/德州儀器 |
20+ |
NA |
53650 |
TI原裝主營(yíng)-可開(kāi)原型號(hào)增稅票 |
|||
TI |
20+ |
射頻元件 |
2255 |
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件! |
|||
TI(德州儀器) |
2021+ |
VQFN-76 |
499 |
||||
TI |
22+ |
76VQFN Dual Rows |
9000 |
原廠渠道,現(xiàn)貨配單 |
|||
TI |
23+ |
76VQFN Dual Rows |
9000 |
原裝正品,支持實(shí)單 |
|||
TI |
21+ |
標(biāo)準(zhǔn)封裝 |
3844 |
進(jìn)口原裝,訂貨渠道! |
|||
TI(德州儀器) |
23+ |
N/A |
6000 |
公司只做原裝,可來(lái)電咨詢 |
|||
TI(德州儀器) |
24+ |
VQFN76 |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!! |
|||
TI(德州儀器) |
24+ |
NA/ |
8735 |
原廠直銷,現(xiàn)貨供應(yīng),賬期支持! |
CC2564CRVMR.A 資料下載更多...
CC2564CRVMR.A 芯片相關(guān)型號(hào)
- 136181
- ALCT-142-D
- ALCT-142-DSLASHQ
- ALCT-142-F
- ALCT-142-FSLASHQ
- ALCT-142-G
- ALCT-142-GSLASHQ
- ALCT-142-H
- ALCT-142-HSLASHQ
- ALCT-142-J
- ALCT-142-JSLASHQ
- ALCT-142-P
- ALCT-142-PSLASHQ
- CC2564CRVMR
- CC2564CRVMR.B
- CC2564CRVMT
- CC2564CRVMT.A
- CC2564CRVMT.B
- LKG2A472MESCAK
- UC2901
- UC2901D
- UC2901D.A
- UC2901DTR
- UC2901DTR.A
- UC2901-EP
- UC2901J
- UC2901J.A
- UC2901N
- UC2901N.A
- UF5408
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