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Features

For surface mounted applications in order to optimize board space

Low profile package

Built-in strain relief

Glass passivated junction

Low inductance

Excellent clamping capability

5000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%

Fast response time

Typical IR less than 2μA

High Temperature soldering: 260℃/10 seconds at terminals

Plastic package has underwriters laboratory flammability 94V-0

Meets MSL level 1, per J-STD-020

Safety certification: UL: E244458

IEC61000-4-2 ESD 30KV Air, 30KV contact compliance

Applications

■ I/O interface

■ AC/DC power supply

■ Low frequency signal transmission line (RS232, RS485, etc.)