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PF38F5070M0X3B0中文資料
PF38F5070M0X3B0數(shù)據(jù)手冊(cè)規(guī)格書PDF詳情
Introduction
This datasheet contains information about the Numonyx? Wireless Flash Memory (W18) device family. This section describes nomenclature used in the datasheet. Section 2.0provides an overview of the W18 flash memory device. Section 6.0, Section 7.0, and Section 8.0describe the electrical specifications for extended temperature product offerings. Ordering information can be found in Section C.
Product Features
? High Performance Read-While-Write/Erase
— Burst frequency at 66 MHz (zero wait states)
—60ns Initial access read speed
— 11 ns Burst mode read speed
— 20 ns Page mode read speed
— 4-, 8-, 16-, and Continuous-Word Burst mode reads
— Burst and Page mode reads in all Blocks, across all partition boundaries
— Burst Suspend feature
— Enhanced Factory Programming at 3.1 μs/word ?
Security
—128-BitOTP Protection Register:
64 unique pre-programmed bits + 64 user-programmable bits
— Absolute Write Protection with VPP at ground
— Individual and Instantaneous Block Locking/Unlocking with Lock-Down Capability?
Quality and Reliability
—Temperature Range:–40 °C to +85 °C
— 100K Erase Cycles per Block
— 90 nm ETOX? IX Process
— 130 nm ETOX? VIII Process
Architecture
— Multiple 4-Mbit partitions
— Dual Operation: RWW or RWE
— Parameter block size = 4-Kword
— Main block size = 32-Kword
— Top or bottom parameter devices
—16-bit wide data bus
Software
— 5 μs (typ.) Program and Erase Suspend latency time
— Flash Data Integrator (FDI) and Common Flash Interface (CFI) Compatible
— Programmable WAIT signal polarity
Packaging and Power
— 90 nm: 32- and 64-Mbit in VF BGA
— 130 nm: 32-, 64-, and 128-Mbit in VF BGA
— 130 nm: 128-Mbit in QUAD+ package
— 56 Active Ball Matrix, 0.75 mm Ball-Pitch
—VCC= 1.70 V to 1.95 V
—VCCQ(90 nm) = 1.7 V to 1.95 V
—VCCQ(130 nm) = 1.7 V to 2.24 V or 1.35 V to 1.80 V
—VCCQ(130 nm) = 1.35 V to 2.24 V
— Standby current (130 nm): 8 μA (typ.)
— Read current: 8 mA (4-word burst, typ.)
PF38F5070M0X3B0產(chǎn)品屬性
- 類型
描述
- 型號(hào)
PF38F5070M0X3B0
- 制造商
NUMONYX
- 制造商全稱
Numonyx B.V
- 功能描述
StrataFlash㈢ Cellular Memory
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
INTEL |
1741+ |
BGA |
6528 |
只做進(jìn)口原裝正品假一賠十! |
|||
INTEL |
19+ |
BGA |
256800 |
原廠代理渠道,每一顆芯片都可追溯原廠; |
|||
INTEL |
24+ |
BGA |
80000 |
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開(kāi)13%增 |
|||
INTEL |
24+ |
BGA |
65200 |
一級(jí)代理/放心采購(gòu) |
|||
INTEL |
24+ |
BGA |
3000 |
只做原裝正品現(xiàn)貨 歡迎來(lái)電查詢15919825718 |
|||
INTEL |
0706+ |
BGA |
50 |
只做原裝正品現(xiàn)貨 |
|||
INTEL |
24+ |
BGA |
5000 |
全新原裝正品,現(xiàn)貨銷售 |
|||
INTEL |
22+23+ |
BGA |
8000 |
新到現(xiàn)貨,只做原裝進(jìn)口 |
|||
INTEL |
24+ |
BGA |
5000 |
只有原裝 |
|||
美光 |
22+ |
NA |
500000 |
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂 |
PF38F5070M0X3B0 資料下載更多...
PF38F5070M0X3B0 芯片相關(guān)型號(hào)
- 1.5SMC100A
- 1232091
- 91-21SURC
- 91-21SYGC/S530-XX/XXX
- ACT3215A
- BSV23
- BSV25
- CN1J2NTTDD101F
- CW3SCT26A103
- CW5SCT26A103
- HPC1CT631R102M
- LM124_08
- LM224
- LM324
- LMT1-XXX-5
- MO1CT521A473G
- MOS3CT26A103
- MOS5CT26A103
- PF38F5070M0X1B0
- RCR75C
- RKC3BD
- RN412ESTTE1002C200
- RN412ETTE1002C200
- RNS1ECT52R1001B
- RNS1YCT26A1001C
- RPC-000-SS
- S29NS064J0LBFW000
- SN54ALS163B
- V48A15C250A
- ZTX312
Datasheet數(shù)據(jù)表PDF頁(yè)碼索引
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numonyx
Numonyx是一家曾經(jīng)存在的存儲(chǔ)技術(shù)公司,于2008年由英特爾(Intel)和STMicroelectronics共同創(chuàng)立。Numonyx專注于非易失性存儲(chǔ)器(NVM)技術(shù)和閃存存儲(chǔ)器技術(shù),為客戶提供各種存儲(chǔ)解決方案和產(chǎn)品。 Numonyx的產(chǎn)品包括閃存存儲(chǔ)器、嵌入式存儲(chǔ)器、非易失性存儲(chǔ)器等,在計(jì)算機(jī)、消費(fèi)電子、通信、汽車等領(lǐng)域得到廣泛應(yīng)用。公司致力于技術(shù)創(chuàng)新與研發(fā),不斷提升產(chǎn)品性能、可靠性和創(chuàng)新性,以滿足客戶不斷增長(zhǎng)的需求。 2010年,美國(guó)存儲(chǔ)技術(shù)公司Micron Technology收購(gòu)了Numonyx,并將其整合為Micron的一部分。這一收購(gòu)使Micron得以拓展其存儲(chǔ)技術(shù)領(lǐng)域的產(chǎn)