位置：FGG.3K.324.KLAC11Z > FGG.3K.324.KLAC11Z詳情
FGG.3K.324.KLAC11Z中文資料
更新時(shí)間：2025-9-23 14:30:00
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
LEMO |
24+/25+ |
30 |
原裝正品現(xiàn)貨庫存價(jià)優(yōu) |
||||
LEMO |
新 |
3 |
全新原裝 貨期兩周 |
||||
LEM |
24+ |
220 |
|||||
TE/泰科 |
2508+ |
/ |
484664 |
一級(jí)代理，原裝現(xiàn)貨 |
|||
LEM |
23+ |
NA |
1152 |
專做原裝正品,假一罰百! |
|||
24+ |
N/A |
75000 |
一級(jí)代理-主營優(yōu)勢-實(shí)惠價(jià)格-不悔選擇 |
||||
XILINX |
25+23+ |
BGA |
30545 |
絕對(duì)原裝正品全新進(jìn)口深圳現(xiàn)貨 |
|||
xilinx |
22+ |
BGA |
6800 |
||||
xilinx |
23+ |
BGA |
8000 |
全新原裝 |
|||
XILINX |
24+ |
BGA |
9500 |
鄭重承諾只做原裝進(jìn)口現(xiàn)貨 |
FGG.3K.324.KLAC11Z 資料下載更多...
FGG.3K.324.KLAC11Z 芯片相關(guān)型號(hào)
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LEMO相關(guān)芯片制造商
Datasheet數(shù)據(jù)表PDF頁碼索引
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