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位置:AMD-K6-2ESLASH400AMR > AMD-K6-2ESLASH400AMR詳情

AMD-K6-2ESLASH400AMR中文資料

廠家型號(hào)

AMD-K6-2ESLASH400AMR

文件大小

5600.3Kbytes

頁(yè)面數(shù)量

332頁(yè)

功能描述

AMD-K6??2E Embedded Processor

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

簡(jiǎn)稱(chēng)

AMD超威半導(dǎo)體

生產(chǎn)廠商

Advanced Micro Devices

中文名稱(chēng)

美國(guó)超威半導(dǎo)體公司官網(wǎng)

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AMD-K6-2ESLASH400AMR數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情

AMD-K6?-2E Embedded Processor Features

The AMD-K6-2E processor with 3DNow!? technology is a functionally compatible embedded version of the sixth generation, Microsoft? Windows? compatible AMD-K6-2 processor. The AMD-K6-2E embedded processor delivers the same high performance and incorporates the same leading-edge features, including the innovative and efficient RISC86? microarchitecture, a large 64-Kbyte level-one cache (32-Kbyte dual-ported data cache, 32-Kbyte instruction cache with predecode data), and a powerful IEEE 754-compatible and 854-compatible floating-point execution unit.

AMD-K6?-2E Processor

The following are key features of the AMD-K6?-2E processor:

■ Advanced 6-Issue RISC86? Superscalar Microarchitecture

? Ten parallel specialized execution units

? Multiple sophisticated x86-to-RISC86 instruction decoders

? Advanced two-level branch prediction

? Speculative execution

? Out-of-order execution

? Register renaming and data forwarding

? Up to six RISC86 instructions per clock

■ Large on-chip split 64-Kbyte level-one (L1) cache

? 32-Kbyte instruction cache with additional 20 Kbytes of predecode cache

? 32-Kbyte writeback dual-ported data cache

? Two-way set associative

? MESI protocol support

■ 3DNow!? technology

? Additional instructions to improve 3D graphics and multimedia performance

? Separate multiplier and ALU for superscalar instruction execution

■ 321-pin ceramic pin grid array (CPGA) package

■ Socket 7 platform compatible, 66-MHz frontside bus

■ Super7? platform compatible, 100-MHz frontside bus supported on the 300-MHz, 350-MHz, and 400-MHz versions of the AMD-K6-2E processor

■ High-performance industry-standard MMX? instructions

? Dual integer ALU for superscalar execution

■ High-performance IEEE 754-compatible and 854-compatible floating-point unit

■ Industry-standard system management mode (SMM)

■ IEEE 1149.1 boundary scan

■ x86 binary software compatibility

■ Low-power 0.25-micron process technology

? Split-plane power with support for full 3.3 V I/O

? Available with a low-power 1.9-V core voltage and extended temperature rating or with a standard-power 2.2-V core voltage and standard temperature rating

更新時(shí)間:2025-7-1 16:20:00
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Advanced Micro Devices 美國(guó)超威半導(dǎo)體公司

中文資料: 21030條

Advanced Micro Devices, Inc.(AMD)是一家全球領(lǐng)先的半導(dǎo)體公司,成立于1969年,總部位于美國(guó)加利福尼亞州的桑尼韋爾。AMD專(zhuān)注于設(shè)計(jì)和制造高性能計(jì)算、圖形和視覺(jué)計(jì)算技術(shù),產(chǎn)品涵蓋處理器、圖形卡、嵌入式系統(tǒng)等多個(gè)領(lǐng)域,廣泛應(yīng)用于個(gè)人電腦、工作站、服務(wù)器、游戲、數(shù)據(jù)中心及嵌入式設(shè)備等。 AMD在技術(shù)創(chuàng)新方面不斷取得突破,推出了多個(gè)標(biāo)志性的產(chǎn)品,如Ryzen系列處理器、EPYC服務(wù)器處理器、Radeon系列顯卡等。公司以其優(yōu)異的性能和能效比在市場(chǎng)上獲得了良好的聲譽(yù),特別是在游戲和高性能計(jì)算領(lǐng)域受到廣泛認(rèn)可。 近年來(lái),AMD積極推動(dòng)開(kāi)放架構(gòu)和高效能計(jì)算領(lǐng)域的發(fā)展,致力于